ASTM B32 PDF

Standard Specification for Solder Metal1 This standard is issued under the fixed designation B 32; the number immediately following the designation indicates the year of original adoption or, in the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. A superscript epsilon e indicates an editorial change since the last revision or reapproval. This standard has been approved for use by agencies of the Department of Defense.

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Includes all amendments and changes through Reapproval Notice , Detail Summary View all details. Price USD. Single User. In Stock. Need it fast? Ask for rush delivery. Most backordered items can be rushed in from the publisher in as little as 24 hours. Some rush fees may apply. Add to Cart. View Full Details and Buy. Complementary Documents and Links:. This specification covers solder metal alloys commonly known as soft solders used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tinantimony- copper-silver, tin-antimony-copper-silver-nickel, tinsilver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points.

This specification includes solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbon, wire, and solder paste. The values stated in inch-pound units are to be regarded as standard.

The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

This standard does not purport to address all of the safety concerns, if any, associated with its use. Browse Publishers. Top Sellers. My Account. Corporate Sustainability. Investor Relations. All Rights Reserved. Update Cart. Create New Account.

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Standard Specification for Solder Metal

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ASTM B32.pdf

Historical Version s - view previous versions of standard. Work Item s - proposed revisions of this standard. More B This specification covers solder metal alloys also known as soft solders used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-silver, tin-antimony-copper-silver-nickel, tin-silver, tin-copper-silver, and lead-tin-silver, used for the purpose of joining together two or more metals at temperatures below their melting points. Included here are solders in the form of solid bars, ingots, powder and special forms, and in the form of solid and flux-core ribbons, wires, and solder pastes. Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not taken into account here. Solders shall also meet physical property requirements such as paste texture, powder mesh size, viscosity, solder pool, and dryness, and pass performance requirements such as chlorides and bromides test, copper mirror test, and visual inspection.

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